Budnick Converting ®
3M
5419
Low Static Polyimide Film Tape
A 2.7 mil. translucent, polyimide film backing tape with silicone adhesive used for gold tab protection during wave solder of printed circuit boards. 5419 tape employs proprietary technology that results in a unique and an extremely low electrostatic discharge at unwind and removal from PWB. Conventional polyimide tapes can typically generate over 10,000 volts during use which can damage board mounted electronic components. Tape 5419 overcomes this problem without any drawbacks of "anti-static" or "static-free" tapes. Polyimide and polyester films are very similar at room temperature. However, as you increase or decrease the temperature, the properties of polyimide are less affected and does not soften at elevated temperatures, therefore, the film provides an excellent release surface.
Converting Services
- Precision Cutting
- Die Cutting
- Slitting
- Printing
- Laminating and Coating
- Spooling and Finishing
- Consulting & Process Audit
- Prototyping
- Inventory Management
At Budnick, we specialize in custom converting these materials into labor saving, user-friendly parts.
| Backing/Carrier | Polyimide |
|---|---|
| Adhesive | Silicone |
| Thickness | 2.7 Mils |
| Tensile | 33.00 lbs/in |
|---|---|
| Elongation | 60.00% |
| Adhesive Activation | Pressure |
| Adhesion (unwind) | 20 oz/in |
| Min. Application Temp | 40° F |
|---|---|
| Min. Service Temp | -100° F |
| Max Short-Term Temp | 500° F |
| Max Long-Term Temp |
Product Features
- 1.0 mil. polyimide backing
- 1.7 mil. silicone adhesive
- Static charge (measured at 50% R.H. in an ESD controlled environment): removal from roll - 150 volts; removal from PWB - 50 volts
- Polyimide film is dimensionally stable at high temperatures
- Silicone adhesive reduces adhesive transfer at high temperatures
- Low static virtually eliminates circuit board degradation due to electrostatic discharge
- Promotes high productivity
- Protects surfaces, which reduces replacement costs
- Reduces costly board waste due to component failure
- Flame retardant and chemical resistant
Adhesive Tape Applications
- Mask for printed circuit boards during wave solder or solder dip process
- Used as release surface in fabrication of parts cured at elevated temperatures
Adhesive Tape Colors
- Gold
Data provided by Budnick Converting, Inc.
The physical properties listed are typical values and are not to be considered as specifications. Our suggestions for use are based on tests we believe to be reliable. However, the purchaser must carry out their own tests to determine the suitability of the product for their internal use. Information is given in good faith, but without warranty.
It is essential, as with all pressure-sensitive tapes, that the surface to which the tape is applied be clean, dry and free of grease and oil.
Shelf life from date of manufacture is based on the product being stored at 70°F(21°C) / 50% relative humidity out of direct sunlight.
Specification compliance is dynamic and should only be used as a general guide. Always confirm that the tape you are interested in currently complies with all specification requirements. Please verify that the product number that you select is available in the proper size and color to meet your specification.